TE Connectivity released its newly optical flex circuit cable assemblies
TE Connectivity has released its newly developed optical flex circuit cable assemblies. These compact, robust fiber optic circuits offer a multifiber management solution for high-speed electronic packaging. Fully customizable for both card-to-card and…
TE Connectivity will introduce a number of key innovations at SPS IPC Drives 2017
TE Connectivity, a world leader in connectivity and sensors, will introduce a number of key innovations at SPS IPC Drives 2017, which takes place November 28-30 in Nuremberg, Germany. SPS provides an excellent…
TE Connectivity adds Deutsch DMC cable clamps for aerospace applications
TE Connectivity has recently released its DEUTSCH DMC-MD single module cable clamp. This new accessory is compatible with the existing DMC-MD single module product line. The product is ideal for use where robust…
TE Connectivity lebuts ChipConnect cable assemblies
TE Connectivity (TE) has launched its new ChipConnect internal faceplate-to-processor (IFP) cable assemblies. Designed for Intel Omni-Path Architecture (OPA), TE’s ChipConnect assemblies mate directly with LGA 3647 sockets at the processor and Intel…
TE Connectivity provides snap-on pre-printed wire markers
TE Connectivity has launched its market-leading STD and STB snap-on pre-printed markers for wire and cable identification. The markers are ideally suited for projects in energy, such as power stations, oil refineries and…